NORDSON DIMA
https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-sys tems
Nordson DIMA poskytuje systémy pre Hot Bar Soldering od stolových aplikácií cez samostatne stojace systémy až po plne automatizované in‐line systémy spájkovania, spájania teplom, ACF laminácie a Heat Seal Bonding aplikácií.
C‐Drive Head
The C‐Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C‐Flow Controller, Temperature, Force, and Displacement Monitoring give…
C‐Flow Controller with touchscreen
The C‐Flow Controller stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control,…
C‐Base with touchscreen
The C‐Base Bonding/Soldering system is a combination of a CFlow and a C‐Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control…
C‐Prime with touchscreen
C‐Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm.
C‐TurnFlux
The C‐TurnFlux is the topline product for automated Flux Dispensing in combination with automated Hot Bar Reflow Soldering. An ultimate system for high end applications, where output and quality…
C‐Tack with touchscreen
C‐Tack Desktop System for ACF Laminating, also called Pre‐Tacking or Pre‐Bonding.
